The PCB Cap Layer: A Deep Dive into Its Role in Lamination and Performance Introduction    In the relentless pursuit of higher density, better reliability, and improved electrical performance, modern printed circuit board manufacturing has evolved far beyond traditional layer stacking. As interconnect complexity increases and material tolerances tighten, subtle structural elements once considered...

The Foundation of Reliable Interconnects: Demystifying the Cap Layer in High-Density PCB Fabrication Introduction: Why the Cap Layer Matters More Than Ever    As printed circuit boards continue to evolve toward higher density, thinner geometries, and more aggressive electrical performance targets, many traditional assumptions in PCB fabrication are being quietly challenged. Processes and structure...

A Costly Perforation: Addressing Drill Break-Through to Protect PCB Manufacturing Yield Drill Break-Through Definition and Technical Meaning in PCB Manufacturing    Drill Break-Through refers to a condition in which a drilled hole penetrates beyond its intended layer boundary, unintentionally breaching adjacent copper layers or dielectric structures. While drilling is designed to create vias or th...

The Red Flag in Drilling: What Drill Break-Through Reveals About Your PCB Process Control Introduction: Why Drill Break-Through Deserves More Attention    In modern PCB manufacturing, drilling is often perceived as a mature and well-controlled process. CNC drilling machines are faster, more precise, and more automated than ever before. Yet, hidden within this seemingly stable operation is a subtle...