The Foundation for Blind Vias: A Deep Dive into Inner-Pad Design and Manufacturing for HDI PCBs 1. Understanding the Inner Pad: The Inner-Pad Definition and Functional Principles 1.1 The Inner-Pad and Its Role in Blind-Via HDI Structures    An Inner-Pad can be defined as the conductive copper landing feature on a sub-surface layer of a PCB that receives a blind via or microvia drilled from an uppe...

The Hidden Challenge: Ensuring Integrity of Inner Pads in PCB Stack-Up Lamination 1. Introduction     The multilayer printed circuit board has become the backbone of modern electronic hardware, enabling increasingly dense circuitry, high-speed signaling, and advanced power management within compact footprints. Yet beneath the visible surface of copper traces and laminated insulation lies a set of...

Signal Degradation in PCBs: A Guide to Root Causes and Manufacturing-Led Mitigation Techniques 1. Understanding Signal Degradation: Foundations, Mechanisms, and Engineering Significance    Signal degradation occurs when an electrical signal experiences any type of distortion, attenuation, delay, or unwanted interference while traveling across traces, vias, dielectric mediums, or copper interfaces...

Preserving Signal Integrity: Manufacturing Techniques to Combat Signal Degradation in PCBs Understanding Signal Degradation: Fundamental Definitions and Physical Mechanisms What Signal Degradation Means in PCB Engineering     Signal Degradation refers to the gradual deterioration of an electrical signal as it travels along PCB traces, vias, and interconnects, resulting in: Loss of amplitude Increa...