BGA Assembly Capabilities
BGAs (Ball Grid Arrays) are SMD components with connections on the bottom of the component.
Each pin is provided with a solder ball. All connections are distributed in a uniform
surface grid or matrix on the component. Common grids are nowadays: 1.27 mm – 1.00 mm – 0.80
mm – 0.50 mm.
With several hundred component connections, the number of „routable” pins is limited per
layer. The inner pins of the BGA can only be connected through a via and routed to another
layer > DogBone technology.
If the pitch is even smaller, or if traces between the solder pads are necessary, the
via-in-pad technology is recommended: The vias are placed directly into the solder pads of
Manufacturer’s instructions must be followed carefully. These define the elementary
connection distances, solder ball diameters and the housing geometries. Other technical
details such as technology of the vias or trace -width and -spacing will be specified by the
designer. For possible parameters check the following tables.
BGA Design proposal
The values given are design proposals, values of component data sheets are always
*plus 50µm circumferential solder-stop clearance
**plus 50µm circumferential solder-stop clearance, please order as IPC 4761 Type VII: Filled
& Capped Vias
BGA Design Detail
The values given are design proposals, values of component data sheets are
Inner layers Fan-Out with 1 track
Inner layers Fan-Out with 2 track
Inner layers Fan-Out with 3 track
BGA 0.4mm Pitch
The PCB design for BGA with 0.4mm pitch is special production and requires the use of
HDI-Technology and Via-in-Pad. Please always consult our technical department.
TOP-Side of PCB
BGA with 0.4mm Pitch
Via-in-Pad (Filled & Capped Vias)
Annular ring: 84.5µm
Copper to copper: 81µm
Solder-stop bridge: 51µm
Solder-stop clearance: 19µm
BOT-Side of PCB
Routing of 0.4mm pitch BGA with maximum parameters.
Annular ring: varying, min. 61µm
Copper to copper: 127µm