BGAs (Ball Grid Arrays) are SMD components with connections on the bottom of the component. Each pin is provided with a solder ball. All connections are distributed in a uniform surface grid or matrix on the component. Common grids are nowadays: 1.27 mm - 1.00 mm - 0.80 mm - 0.50 mm. With several hundred component connections, the number of „routable" pins is limited per layer. The inner pins of t...

Ball Grid Array (BGA): Features, Soldering Technique, and X-Ray Inspection Electronic devices are shrinking in size and increasing in complexity due to improvements in VLSI technology. The need for more interfacing input/output (I/O) leads and smaller device sizes have increased and this need can be met with the BGA (Ball Grid Array) package. Electronic devices are shrinking in size and increasing...

Though surface mount technology has become the main mounting method in PCB manufacturing, there are still some components that are not suitable in SMT assembly. Then SMT assembly and THT assembly need to be applied on the same board. This combination of assembly technologies is called a mixed assembly, which does not use solder paste during the manufacturing process. Most of the components are wel...

A surface mount technology (SMT) stencil may also be called a PCB stentcil, solder paste stencil, or laser stencil. An SMT Stencil’s main purpose is to simply transfer the solder paste to a bare circuit board. A stainless steel foil is laser cut to create an opening for each surface mount device on the board. Once the printed circuit board (PCB) stencil is properly aligned with the top of the boar...