Balancing Cost and Performance: A Guide to CEM-3 and FR-4 in Multilayer PCBs Material Selection 1: Fundamentals of Multilayer PCBs Material Selection 1.1 The Definition and Conceptual Framework of Multilayer PCBs Material Selection  At its core, Multilayer PCBs Material Selection refers to the process of identifying and choosing the most appropriate substrate and dielectric materials that form the...

The Final Frontier in PCB Fabrication: A Guide to Surface Treatment Selection Definition and Fundamentals of Surface Treatment 1.1 Understanding the Definition of Surface Treatment  At its core, Surface Treatment in PCB manufacturing refers to the application of a protective and solderable finish on exposed copper areas after etching and before assembly. Copper, though an excellent electrical cond...

The Flatness & Reliability Advantage: Why Use an Immersion Gold PCB Board for Your Project 1. Understanding the Core Principles of Immersion Gold Technology 1.1 The Science Behind Immersion Gold Surface Treatment  At its core, Immersion Gold refers to a surface finish applied through a chemical displacement reaction, where gold is deposited over a thin nickel barrier layer. This technique, par...

Choosing the Right BGA: A Breakdown of Package Types for Optimal PCB Design 1. Understanding Package Types: The Foundation of BGA Technology      The term Package Types refers to the physical and structural configurations used to encapsulate and connect semiconductor dies to printed circuit boards. In the context of BGA technology, these types determine not only how electrical connections are dist...