Immaculate Component Sourcing Made Simple Getting the right components for your PCB is the first step towards engineering the product functionalities you seek. Even a small mishap in the process can lead to capital losses, functional asymmetries in the expected & real performance, as well as operational hazards caused by the delay and change orders. While every enterprise and individual working wi...

Through holes on a PCB refer to a hole that is drilled from the top and through to the bottom of a PCB, these can be plated (PTH) or non-plated (NPTH). Through-hole technology, also spelled “thru-hole”, refers to the mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in PCBs and soldered to pads on the opposite side...

BGAs (Ball Grid Arrays) are SMD components with connections on the bottom of the component. Each pin is provided with a solder ball. All connections are distributed in a uniform surface grid or matrix on the component. Common grids are nowadays: 1.27 mm - 1.00 mm - 0.80 mm - 0.50 mm. With several hundred component connections, the number of „routable" pins is limited per layer. The inner pins of t...

Ball Grid Array (BGA): Features, Soldering Technique, and X-Ray Inspection Electronic devices are shrinking in size and increasing in complexity due to improvements in VLSI technology. The need for more interfacing input/output (I/O) leads and smaller device sizes have increased and this need can be met with the BGA (Ball Grid Array) package. Electronic devices are shrinking in size and increasing...