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2025-12-15 52
The Final Correction: Ensuring Yield and Reliability Through Secondary Drilling in PCB Production
The Final Correction: Ensuring Yield and Reliability Through Secondary Drilling in PCB Production Introduction    In modern printed circuit board (PCB) production, yield and reliability are no longer achieved solely through advanced materials or high-speed imaging technologies. Instead, they increasingly depend on subtle corrective processes that refine what earlier stages could not perfect. Among...
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2025-12-12 49
Tenting in PCB Manufacturing: The Essential Process for Via Protection and Solder Mask Integrity
Tenting in PCB Manufacturing: The Essential Process for Via Protection and Solder Mask Integrity 1. Introduction to Tenting in PCB Manufacturing    Printed Circuit Boards (PCBs) form the backbone of modern electronic devices, enabling the interconnection of electronic components while maintaining signal integrity and structural stability. As electronics continue to shrink in size while increasing...
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2025-12-11 37
The Cost-Effective Guardian: The Role of Tenting in Ensuring Basic PCB Reliability
The Cost-Effective Guardian: The Role of Tenting in Ensuring Basic PCB Reliability 1: Understanding the Fundamentals of T-enting 1.1 What Tenting Means in PCB Manufacturing — T-enting as a Fundamental Protective Step    Tenting refers to the practice of covering a via with dry film photoresist during the imaging process so that the copper annular ring and the hole opening are both isolated from su...
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2025-12-10 39
Precision Below the Solder: The Engineering Challenge of Via-in-Pad PCB Manufacturing
Precision Below the Solder: The Engineering Challenge of Via-in-Pad PCB Manufacturing Introduction    Modern electronic devices continue to shrink, accelerate, and integrate more advanced functions into smaller physical footprints. These rapidly tightening design envelopes force PCB engineers to rethink the way interconnects are created, how stacked structures behave under electrical stress, and h...
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2025-12-09 53
Revolutionizing Assembly: How Via-in-Pad Manufacturing Enhances Solder Joint Reliability
Revolutionizing Assembly: How Via-in-Pad Manufacturing Enhances Solder Joint Reliability 1. Understanding the Fundamentals of Via-in-Pad Technology 1.1 The Evolution of PCB Vias and the Emergence of Via-in-Pad    The evolution of PCB vias has always mirrored the progression of electronics toward higher density and greater complexity. At the earliest stages of PCB development, through-holes were th...
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2025-12-08 41
Depth Tolerance in PCB Manufacturing: The Foundational Metric for Reliability and Yield
Depth Tolerance in PCB Manufacturing: The Foundational Metric for Reliability and Yield 1: Understanding Depth Tolerance in PCB Manufacturing – Depth Tolerance as a Geometrical Control Parameter    Depth Tolerance in PCB manufacturing refers to the allowable deviation between the intended and actual depth of material removal, drilling, etching, or cavity formation within a printed circuit board. A...
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2025-12-05 52
Precision Below the Surface: The Challenges and Control of Depth Tolerance in Multilayer PCB Fabrication
Precision Below the Surface: The Challenges and Control of Depth Tolerance in Multilayer PCB Fabrication 1. Understanding Depth Tolerance in Multilayer PCB Fabrication 1.1 What is Depth Tolerance    Depth Tolerance refers to the allowable deviation from a specified material removal depth or layer-termination depth during PCB fabrication. It is a quantitative measure defining how deep a tool, laser...
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2025-12-04 56
From Problem to Precision: Mastering the Stub Effect in Advanced PCB Manufacturing Processes
From Problem to Precision: Mastering the Stub Effect in Advanced PCB Manufacturing Processes Introduction    Over the last decade, printed circuit boards have undergone a radical transformation from relatively simple interconnection platforms to high-density, high-frequency transmission ecosystems. As designs transition from megahertz signals to multi-gigabit transmission lines, the smallest physi...
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2025-12-03 52
The High-Frequency Saboteur: How the Stub Effect Degrades Performance in PCB Fabrication
The High-Frequency Saboteur: How the Stub Effect Degrades Performance in PCB Fabrication 1. Understanding the Stub Effect: Definition and Fundamental Behavior    At its simplest, the Stub Effect refers to the electrical behavior of an unused portion of a conductive via barrel that remains connected to no active trace but exists as a physical segment of metal. This leftover copper becomes an uninte...
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2025-12-02 59
Backdrill in PCB Manufacturing: The Definitive Technique for Stub Removal and Signal Integrity
Backdrill in PCB Manufacturing: The Definitive Technique for Stub Removal and Signal Integrity 1. Introduction to High-Speed PCB Manufacturing    The electrical performance of modern PCBs is shaped by a fundamental transformation in computing, communication, and sensing technologies. Bandwidth requirements have shifted upward so dramatically that classical PCB manufacturing rules, traditionally op...
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2025-12-01 62
Precision at Depth: Mastering the Challenges of Backdrill in Multi-Layer PCB Fabrication
Precision at Depth: Mastering the Challenges of Backdrill in Multi-Layer PCB Fabrication 1. Introduction    In the era of high-speed, high-density, and increasingly multilayer electronic systems, the role of micro-manufacturing technologies has grown from supportive to absolutely foundational. Among the many advanced processes that govern signal integrity and structural precision in printed circui...
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2025-11-28 66
The Foundation for Blind Vias: A Deep Dive into Inner Pad Design and Manufacturing for HDI PCBs
The Foundation for Blind Vias: A Deep Dive into Inner-Pad Design and Manufacturing for HDI PCBs 1. Understanding the Inner Pad: The Inner-Pad Definition and Functional Principles 1.1 The Inner-Pad and Its Role in Blind-Via HDI Structures    An Inner-Pad can be defined as the conductive copper landing feature on a sub-surface layer of a PCB that receives a blind via or microvia drilled from an uppe...
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