A Threat to PCB Reliability: In-Depth Cause Analysis and Solutions for Copper Wire Shedding 1. Understanding Copper Wire Shedding in PCB Manufacturing  To truly comprehend the implications of Copper Wire Shedding, one must first understand what this failure mode represents in the context of modern PCB manufacturing. Copper Wire Shedding is not a singular event, but rather a culmination of multiple...

PCB Impedance Testing: The Definitive Verification for High-Speed Circuit Performance Understanding the Fundamentals of PCB Impedance Testing  To understand PCB Impedance Testing, we must first define impedance in the context of circuit boards. Impedance, measured in ohms (Ω), is the total opposition a circuit offers to alternating current at a specific frequency. In high-speed PCBs, the impedance...

Balancing Cost and Performance: A Guide to CEM-3 and FR-4 in Multilayer PCBs Material Selection 1: Fundamentals of Multilayer PCBs Material Selection 1.1 The Definition and Conceptual Framework of Multilayer PCBs Material Selection  At its core, Multilayer PCBs Material Selection refers to the process of identifying and choosing the most appropriate substrate and dielectric materials that form the...

The Final Frontier in PCB Fabrication: A Guide to Surface Treatment Selection Definition and Fundamentals of Surface Treatment 1.1 Understanding the Definition of Surface Treatment  At its core, Surface Treatment in PCB manufacturing refers to the application of a protective and solderable finish on exposed copper areas after etching and before assembly. Copper, though an excellent electrical cond...